REAP (Raster E-Beam Advanced Process) using 50kV raster E-beam system for sub-100nm node mask technologyBAIK, Ki-Ho; DEAN, Robert; MUELLER, Mark et al.SPIE proceedings series. 2002, pp 401-411, isbn 0-8194-4434-0, 2VolConference Paper

Diffusion of Amines from Resist to BARC LayerSHIRAI, Masamitsu; HATSUSE, Tatsuya; OKAMURA, Haruyuki et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7972, issn 0277-786X, isbn 978-0-8194-8531-1, 79721O.1-79721O.3, 2Conference Paper

Understanding quencher mechanisms by considering photoacid -dissociation equilibrium in chemically-amplified resistsNAGAHARA, Seiji; LEI YUAN; NAKANO, Takanori et al.SPIE proceedings series. 2005, isbn 0-8194-5733-7, 2Vol, Part 1, 338-349Conference Paper

Quantum yields of photoacid generation in 193-nm chemically amplified resists by fluorescence imaging spectroscopyRAY, Krishanu; MASON, Michael D; GROBER, Robert D et al.Chemistry of materials. 2004, Vol 16, Num 26, pp 5726-5730, issn 0897-4756, 5 p.Article

Polymer design for 157 nm chemically amplified resistsITO, Hiroshi; WALLRAFF, Greg M; BROCK, Phil et al.SPIE proceedings series. 2001, pp 273-284, isbn 0-8194-4031-0, 2VolConference Paper

Early mask results of KRS-XE and current progress in improving sensitivity and etch resistanceDEVERICH, Christina; WATTS, Andrew; MEDEIROS, David et al.SPIE proceedings series. 2002, pp 229-240, isbn 0-8194-4517-7, 12 p.Conference Paper

Resolution, LER and Sensitivity Limitations of PhotoresistGALLATIN, Gregg M; NAULLEAU, Patrick; NIAKOULA, Dimitra et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 69211E.1-69211E.11, issn 0277-786X, isbn 978-0-8194-7106-2Conference Paper

Potential of DNQ/novolac and chemically amplified resists for 100 nm device generation maskmakingTAN, Zoilo C. H; PHUONG LE; COLEMAN, Tom et al.Microelectronic engineering. 2001, Vol 57-58, pp 531-538, issn 0167-9317Conference Paper

Dependence of resist profile on Exposed Area RatioSHIOBARA, Eishi; KAWAMURA, Daisuke; MATSUNAGA, Kentaro et al.SPIE proceedings series. 2001, pp 628-636, isbn 0-8194-4031-0, 2VolConference Paper

In quest of predictive lithography simulationKALUS, Christian K; BUSS, Hinderk M; BROOKER, Peter D et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-6197-0, vol 2, 61541S.1-61541S.10Conference Paper

Dissolution Kinetics and Deprotection Reaction in Chemically Amplified Resists upon Exposure to Extreme Ultraviolet RadiationYAMAMOTO, Hiroki; KOZAWA, Takahiro; TAGAWA, Seiichi et al.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7273, issn 0277-786X, isbn 978-0-8194-7526-8 0-8194-7526-2, 72731X.1-72731X.9, 2Conference Paper

Performance comparison of chemically amplified resists under EUV, EB and KrF exposureSHIMIZU, Daisuke; MATSUMURA, Nobuji; KAI, Toshiyuki et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-6196-2, 2Vol, Part 2, 615344.1-615344.10Conference Paper

From microchannels to nanochannels in a bilayer resistOCOLA, L. E; STEIN, A.SPIE proceedings series. 2005, pp 421-426, isbn 0-8194-5545-8, 6 p.Conference Paper

A novel post exposure bake technique to improve CD uniformity over product wafersTAKEISHI, T; HAYASAKI, K; SHIBATA, T et al.SPIE proceedings series. 2005, isbn 0-8194-5733-7, 2Vol, Part 1, 222-229Conference Paper

The elongation effect of a protecting layer for film life of chemically amplified type e-beam resistOZAWA, Kakuei; ABE, Nobunori.SPIE proceedings series. 2001, pp 351-355, isbn 0-8194-4111-2Conference Paper

Investigation of shipping material and reticle storage environment to dark loss stability of chemically amplified resistDEVERICH, Christina; RABIDOUX, Paul; RACETTE, Ken et al.Proceedings of SPIE, the International Society for Optical Engineering. 2005, issn 0277-786X, isbn 0-8194-6014-1, 2Vol, Part 2, 59923C.1-59923c.8Conference Paper

Comparative evaluation of e-beam sensitive chemically amplified resists for mask makingIRMSCHER, Mathias; BEYER, Dirk; SPRINGER, Reinhard et al.SPIE proceedings series. 2002, pp 176-187, isbn 0-8194-4517-7, 12 p.Conference Paper

Novel CA resists with photoacid generator in polymer chainHENGPENG WU; GONSALVES, Kenneth E.SPIE proceedings series. 2001, pp 521-527, isbn 0-8194-4031-0, 2VolConference Paper

Reduction of post exposure delay time and contamination sensitivity in chemically amplified resists : application for lithography using off-line environmentPAIN, L; SCARFOGLIERE, B; TEDESCO, S et al.Microelectronic engineering. 2001, Vol 57-58, pp 511-516, issn 0167-9317Conference Paper

Vacuum delay effect of CAR in mask fabricationKIM, Chang-Hwan; JEON, Chan-Uk; HAN, Sung-Jae et al.SPIE proceedings series. 2001, pp 285-293, isbn 0-8194-4029-9Conference Paper

Deprotonation mechanism of poly(styrene-acrylate)-based chemically amplified resistTAJIMA, Y; OKAMOTO, K; KOZAWA, T et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7972, issn 0277-786X, isbn 978-0-8194-8531-1, 79721N.1-79721N.7, 2Conference Paper

Design, Synthesis and Characterization of Fluorine-free PAGs for 193 nm LithographySEN LIU; GLODDE, Martin; RAO VARANASI, Pushkara et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7639, issn 0277-786X, isbn 978-0-8194-8053-8 0-8194-8053-3, 76390D.1-76390D.8, 2Conference Paper

Reduction of resist heating effect by writing order optimization, part IIGOTO, Kazuya; WATAKABE, Kazutaka; KOMAGATA, Tadashi et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 660721.1-660721.8, issn 0277-786X, isbn 978-0-8194-6745-4Conference Paper

Exposure simulation model for chemically amplified resistsKIM, Sang-Kon.Optical review. 2003, Vol 10, Num 4, pp 335-338, issn 1340-6000, 4 p.Article

Molecular resists based on calix[4]resorcinarene derivatives for EB lithographyOKUYAMA, Kenichi.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7273, issn 0277-786X, isbn 978-0-8194-7526-8 0-8194-7526-2, 7273U.1-72732U.7, 2Conference Paper